Silicon-on-Insulator (SOI) Market Analysis, Strategies, Market Trends, Opportunity Analysis, Gross Margin Study with Forecasts to 2030
Market Research Future (MRFR) announces the publication of its half-cooked research report—Global Silicon on Insulator (SOI) Market 2020–2026.
According to Market Research Future, the
global silicon on insulator (SOI) market has been segmented based on type, wafer size, technology, application, vertical, and region.
Increasing consumption of
consumer electronics has attributed to the growth of the SOI market across the
globe. Also, the concerns regarding minimizing silicon wastage by wafer
manufacturers and fabrication companies have fueled the market growth. However,
these wafers are susceptible to high-pressure conditions which challenge the
manufacturers to develop robust and efficient components.
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Based on type, the market has been segmented into fully depleted silicon on
insulator (FD-SOI), partially depleted silicon on insulator (PD-SOI), power-SOI,
and others. FD-SOI is expected to dominate the global market and is expected to
dominate throughout the forecast period whereas, PD-SOI is expected to witness
the fastest growth during the forecast period. FD-SOI is a planar process
technology that delivers the benefits of reduced silicon geometries and simplifies
the manufacturing process.
By wafer
size, the market has been bifurcated into less than or equal to 200mm and 201mm
and above.
Based on technology, the
market has been segmented into bonding SOI, layer transfer SOI, and Smart Cut.
Bonding SOI technology is used for applications that favor no implantation since
the process minimizes the damage done to the substrate surface. Layer transfer
SOI is highly preferred for the fabrications of SOI wafers since it can precisely
control the thickness of the oxide layer. The SmartCut technology combines the
repeatability of layer transfer SOI with the flexibility of bonding SOI, thus,
providing different oxide film thicknesses and maintaining a high uniformity
across different wafers.
By application, the market
has been segmented into MEMS, power supplies, optical communication, image
sensing, and others. Silicon wafers are primarily used for
manufacturing MEMS. Thus, the buyers highly focus on the performance, cost, and
size of these wafers. This encourages the manufacturers to fabricate wafers for
compact devices with high performance at lower manufacturing costs.
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Based on vertical, the market
has been segmented into consumer electronics, automotive, IT &
telecommunication, aerospace & defense, industrial, and others.
By region, the market has
been segmented into North America, Europe, Asia-Pacific, and the rest of the
world. The
Asia-Pacific region has dominated the global market in 2019 and is expected to
maintain its dominance throughout the forecast period. The region is known as a
manufacturing hub for semiconductor devices and has also witnessed major
adoption of smartphones and other portable devices by consumers. These factors
have contributed to the growth of the SOI market in this region.
Key
Players
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